Hybrid Audio Module for True Wireless Earbuds

Optimized for ANC Earbuds

High SPL and wideband response support active noise cancelling in high-leak and open-fit designs. The electrodynamic woofer, enhanced with Silicon Rubber Technology, delivers extended low-frequency output essential for effective ANC performance.

Hi-Res Bandwidth (up to 40 kHz)

Delivers high-resolution audio with low distortion. The hybrid design combines MEMS precision and electrodynamic bass, providing an extended range to support Hi-Res audio playback and enabling ultrasonic modes for advanced sensing applications.

Integrated crossover & Amplifier

Single-input architecture with a 4 kHz passive crossover and integrated MEMS ASIC amplifier. Simplifies integration and reduces the need for external components.

Compact Form Factor

Measures ∅10 mm × 3.98 mm, making it suitable for TWS earbuds, IEMs, and other miniaturized devices.

All-in-One Audio Architecture

Wide bandwidth audio performance in a compact, ready-to-integrate module.

Co-developed by USound and OBO Pro.2, Greip 1.1 UAM-C1011 integrates:

• MEMS Conamara tweeter for high-frequency detail.
• OBO Pro.2 electrodynamic woofer with Silicon Rubber Technology for enhanced low-end output.
• Tarvos 1.0 MEMS amplifier, matched to the tweeter for clean, efficient drive.

A 4 kHz passive crossover and onboard amplification reduce the need for external circuitry, streamlining development for space-constrained applications.

Empowering Next-Gen TWS & IEMS

Greip 1.1 UAM-C1011 supports the design of TWS earbuds and IEMs that require high audio performance in constrained form factors. The module combines a MEMS tweeter and electrodynamic woofer to deliver full-range output with low distortion and high SPL. Its integrated amplifier and tuned acoustic design simplify system integration, enabling consistent, high-resolution sound reproduction.

Advanced Functionality:
Biosensing via AuriSense

Greip 1.1 UAM-C1011, when used in combination with AuriSense,  USound’s MEMS-based acoustic biosensing algorithm, enables the development of TWS devices with integrated biometric functionality. The MEMS speaker operates in ultrasonic mode concurrently with audio playback, allowing for wear detection and vital sign monitoring without the need for additional sensors. This approach reduces component count and system complexity, supporting compact, cost-effective designs for health-enabled true wireless earbuds.

Accelerate your Development

Benefit from a ready-to-implement in-ear design built around Greip 1.1 UAM-C1011.
Save time, reduce tuning effort, and achieve high acoustic performance right from the start.

Optimized for Performance:

• Dual acoustic paths for woofer and tweeter — clean, efficient output from each driver.
• Helmholtz resonance chamber — enhances SPL and supports full-range response.
• Balanced tuning up to 40 kHz, specifically designed for in-ear form factors.

Use it as a drop-in reference or adapt it to your system — no need to build your acoustic architecture from scratch.